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MacroFlow: Publications

A Software Tool for Rapid Flow and Thermal Design of Electronics Cooling, Semiconductor Processing, and General Flow Systems

  • Improving Productivity in Electronic Packaging with Flow Network Modeling (pdf)
  • Thermal Design Methodology for Electronic Systems (pdf)
  • Analysis and design of Liquid-Cooling Systems Using Flow Network Modeling (FNM) (pdf)
  • A Flow Network Analysis of a Liquid Cooling System that Incorporates Microchannel Heat Sinks (pdf)
  • Design and Verification of a Partial Recirculation Scheme for a Telecom Shelf (pdf)
  • Flow Network Modeling: A Case Study in Expedient System Prototyping (pdf)
  • Thermal Design of a Base Transceiver Station Using Flow Network Modeling (pdf)
  • Use of Flow Network Modeling (FNM) for the Design of an Air-Cooled Server (pdf)
  • Analysis of the Effect of Flow Bypass on the Performance of Heat Sinks Using Flow Network Modeling (FNM) (pdf)
  • Use of Flow Network Modeling (FNM) for the Design of a Burn-in Oven (pdf)
  • Use of Flow network Modeling for the Design of an Intricate Cooling manifold (pdf)
  • Rapid Scale-up Design of a Forced Convection, Radio Frequency Absorption Cooling using Flow Network Modeling and Computational Fluid Dynamics (pdf)
  • Use of Flow Network Modeling (FNM) for Enhancing the Design Process of Electronic Cooling Systems (pdf)
  • Thermal Analysis of an Electronics Enclosure: Coupling Flow Network Modeling (FNM) and Computational Fluid Dynamics (CFD) (pdf)
  • Analysis of Flow Distribution in a Power Supply Using Flow Network Modeling (FNM) (pdf)